Non-volatile memory structure

ABSTRACT

A non-volatile memory array structure includes N bit lines, M first word lines, M×N first memory cells, a second word line, n repair circuits and a sense amplifier. The N bit lines and M first word lines are interlaced to control the M×N first memory cell. The second word line is placed across the n bit lines. Each of the repair circuits is electrically connected between the corresponding bit line and the sense amplifier. M and N are natural number.

RELATED APPLICATIONS

This application is a Continuation patent application of co-pendingapplication Ser. No. 11/508,248, filed on 23 Aug. 2006. The entiredisclosure of the prior application Ser. No. 11/508,248, from which anoath or declaration is supplied, is considered a part of the disclosureof the accompanying Continuation application and is hereby incorporatedby reference.

BACKGROUND

1. Field of Invention

The present invention relates to nonvolatile memory array. Moreparticularly, the present invention relates to nonvolatile memory arraywithout a fuse.

2. Description of Related Art

Non-volatile memory devices, such as flash, include a floating gate tostore electric charge and a charge input/output control unit. Flash canbe used for Basic Input Output System (BIOS) of a computer, high-densitynon-volatile memory array can be applied to mass storage devices in aportable Terminal Server, digital camera and memory card of a computer.Non-volatile memory has a lot of advantages, such as quick operationtime, low power consumption and durability. A chip probing process istaken to test if the non-volatile memory functions after thenon-volatile memory is manufactured, and the broken cell must berepaired or separated to avoid affecting all of the non-volatile memory.

FIG. 1 is a schematic view of a conventional non-volatile memory array.A non-volatile memory array 100 includes a sense amplifier 101, metalfuses 103, bit lines 105, a first word line 111 and first memory cells113. In the non-volatile memory array 100, each bit line 105 iselectrically connected to the sense amplifier 101 through a metal fuse103. First word lines 111 and bit lines 105 are interlaced to controlthe first memory cells 113. Because the structure of every bit line 105is the same, the bit line 105 a and the corresponding circuit on it areused as an example for explaining.

In FIG. 1, bit line 105 a is electrically connected to the unit senseamplifier 117 a through the metal fuse 103 a. M word lines 111 and onebit line 105 a control the m memory cells 113 a. Memory cells 113 a areused to store data and put the stored date on the bit line 105 a. Themetal fuses 103 a are used to convey the signal from the bit line 105 ato the sense amplifier 117 a such that the sense amplifier 117 canamplify the signal from the bit line 105 a.

When the non-volatile memory is done, generally, there is a first wafersort stage to test the combinational logic function evaluated by the bitline 105 a. If the logic function of the bit line 105 a fails, the laserrepair machine will trim the metal fuse 103 a by laser to disable theconnection between bit line 105 a and sense amplifier 117 a. By doingso, the sole failed bit line 105 a affecting the whole Non-volatilememory array 100 can be avoided.

However, additional processes will be needed if the laser trimmingmethod is used. For example, after the failed bit line 105 a isidentified at the first wafer sort stage, an additional laser trimmingstep to trim the metal fuse open is needed, followed by an additionalsecond wafer sort stage to test if the trimming works or not such thatthe whole non-volatile memory 100 can operation correctly. Theseadditional steps make the whole test process more complicated.

For the forgoing reasons, there is a need for a new non-volatilestructure that can disable the connection between the failed bit lineand the sense amplifier without laser repair and second wafer sort stageto simplify the circuit test process.

SUMMARY

It is therefore an aspect of the present invention to provide anon-volatile memory array structure, which can disable the connectionbetween failed bit lines and the sense amplifier during the first wafersort stage to omit the laser repair and the second wafer sort process.

According to one embodiment of the present invention, the non-volatilememory array structure includes N bit lines, M first word lines, M×Nfirst memory cells, a second word line, n repair circuits and a senseamplifier. The N bit lines and M first word lines are interlaced tocontrol the M×N first memory cells. The second word line is placedacross the n bit lines. M and N are natural number.

Each of the repair circuits is electrically connected between one of thebit lines and the sense amplifier, each of which includes a secondmemory cell, a first transistor and a second transistor. The firsttransistor has a drain electrically connected to one of the bit lines, asource electrically connected to the sense amplifier, and a gateelectrically connected to the second memory cell. The second transistorhas a drain electrically connected to the second memory cell and thegate of the first transistor, a source electrically connected to thesense amplifier.

During the first wafer sort stage, the auto testing equipment turns onthe first transistors by writing a first voltage to the second memorycells through the second word line. The testing equipment then testseach of the bit lines and identifies the failed bit lines. Next, theauto testing equipment turns on the second transistors to write a secondvoltage to the second memory cell to control the first transistor. Ifthe bit line is failed, the second memory cell turns off thecorresponding first transistor so that the connection between the failedbit line and the sense amplifier is disabled.

As mentioned above, the connections between the failed bit lines and thesense amplifier is disabled during the first wafer stage, so the laserrepair and second wafer sorting process are no longer necessary suchthat the test can be simpler.

It is to be understood that both the foregoing general description andthe following detailed description are examples and are intended toprovide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects and advantages of the presentinvention will become better understood with regard to the followingdescription, appended claims and accompanying drawings where:

FIG. 1 is a schematic view of a conventional non-volatile memorystructure.

FIG. 2 is a schematic view of a non-volatile memory structure of oneembodiment of the present invention;

FIG. 3 is a schematic view of the second memory cell of one embodimentof the present invention.

DESCRIPTION OF THE EMBODIMENTS

Reference is made in detail to the present embodiments of the invention,examples of which are illustrated in the accompanying drawings. Whereverpossible, the same reference numbers are used in the drawings and thedescription to refer to the same or like parts.

FIG. 2 is a schematic view of a non-volatile memory structure of oneembodiment of the present invention. The non-volatile memory structure200 includes N bit lines 203, M first word lines 201, M×N first memorycells 205, a second word line 207, n repair circuits 206 and a senseamplifier 215. The N bit lines 203 and M first word lines 201 areinterlaced to control the M×N first memory cells 205. The second wordline 207 is placed across the n bit lines 203. Among above, the M and Nare natural number.

Each repair circuit 206 is electrically connected between one of the bitlines 203 and the sense amplifier 215, each of which includes a secondmemory cell 209, a first transistor 211 and a second transistor 213. Thefirst transistor 211 has a drain electrically connected to thecorresponding bit lines 203, a source electrically connected to thesense amplifier 215, and a gate electrically connected to the secondmemory cell 209. The second transistor 213 has a gate electricallyconnected to the enabling line 217, a drain electrically connected tothe second memory cell 209 and the gate of the first transistor 211, asource electrically connected to the sense amplifier 215 and the sourceof the first transistor 211.

Because every bit line 203 has the same structure, the bit line 203 a isused as an example. The repair circuit 206 a includes a second memorycell 209 a, a first transistor 211 a and a second transistor 213 a. Thefirst side of the second memory cell 209 a is electrically connected tothe second word line 207, the second side of the second memory cell 209a is electrically connected to the gate of the first transistor 211 aand drain of the second transistor 213 a. The drain of the firsttransistor 211 a is electrically connected to the bit line 203 a, andthe source of the first transistor 211 a is electrically connected tothe source of the second transistor 213 a and the unit sense amplifier215 a.

In the non-volatile memory structure 200, each bit line 203 a evaluatessome combination logic function, to identify if there are failed firstmemory cells on the bit line 203 a and if the bit line 203 a evaluatesthe combination logic function correctly, the auto testing equipmenttakes the following steps during the first wafer sort stage:

1. Turn on the first transistor 211 a and turn off the second transistorto test if there are failed first memory cells on the bit line 203 a.During this step, the auto testing equipment turns on the firsttransistor 211 a by writing a first voltage to the second memory cell209 a through the second word line 207, and turns off the secondtransistor 213 a through the enabling line 217. By turning on the firsttransistor 211 a and turning off the second transistor 213 a, the autotesting equipment can test the bit line 203 a as it used to be.

2. Write a second voltage to the second memory cell. The value of thesecond voltage is determined according to the correctness of thecombination logic function of the bit line 203 a. After step 1 iscompleted, the auto testing equipment turns on the second transistor 213a and disables all the first word lines 201 such that the auto testingequipment can write the second voltage to the second memory cell 209 a.The second voltage will turn on the first transistor 211 a if thecombinational logic function of the bit line 203 a is correct, or thesecond voltage will turn off the first transistor 211 a if the bit line203 a fails.

3. Turning off the second transistor 213 a such that the connectionbetween the bit line 203 a and the unit sense amplifier 215 a can betotally controlled by the first transistor 211 a which is controlled bythe second memory cell 209 a.

The non-volatile memory can execute normal read/write operationsimmediately after the first wafer sort stage listed above. While thenon-volatile memory executes normal read/write operations, the enablingline 217 turns off the second transistor 213 a to avoid the voltage atthe source of first transistor 211 a been affected by the second memorycell 209 a. In addition, during the normal read/write operation, thesecond memory cell 209 a will turn on the first transistor 209 a if thecombinational logic function of the bit line 203 a is correct, or itwill turn off the first transistor 209 a if the bit line 203 a isfailed.

FIG. 3 is a schematic view of a second memory cell 209 a of oneembodiment of the present invention. The second memory cell 209 a stillhas a lot of different types. One kind of second memory type is used forillustration. The second memory cell 209 a includes a third transistor303 a and a capacitor 301 a. The drain of the third transistor 303 a iselectrically connected to the voltage supply 305 a, the gate of thethird transistor 303 a is electrically connected to the second word line207 which is shown in FIG. 2, the source of the third transistor 303 ais electrically connected to the first side 309 a of the capacitor 301 aand the gate of the first transistor 211 a, the second side of thecapacitor 301 a is electrically connected to the ground.

At the first wafer sort stage as stated above, the auto testingequipment needs to turn on the first transistor 211 a to test bit line203 a to identify if bit line 203 a is failed, therefore the autotesting equipment turns on the third transistor 303 a through the secondword line 207 which is electrically connected to the gate of the thirdtransistor 303 a such that the voltage supply 305 a can charge thecapacitor 301 a to turn on the first transistor 211 a. After testing thefunctionality of the bit line 203 a, the auto testing equipment turnsoff the third transistor 303 a through the second word line 207, andcharges or discharges the capacitor 301 a through the second transistor213 a according to the function correctness of the bit line 203 a. Forexample, the capacitor 301 a will be charged to turn on the firsttransistor 211 a if the function of a bit line 203 a is correct, or thecapacitor 301 a will be discharged to turn off the first transistor 211a.

After the first wafer sort stage, the connection between bit line 203 aand unit sense amplifier 215 a is made according to the functioncorrectness of the bit line 203 a.

In conclusion, the embodiments can disable the connections between thefailed bit lines and the sense amplifier during the first wafer stage,so the laser repair and second wafer sorting process are no longernecessary such that the testing process can be more simplified.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentinvention without departing from the scope or spirit of the invention.In view of the foregoing, it is intended that the present inventioncover modifications and variations of this invention provided they fallwithin the scope of the following claims and their equivalents.

1. A repair method for a non-volatile memory array structure wherein thenon-volatile memory array structure includes a plurality of bit lines, aplurality of first memory cells electrically connected to the bit lines,a sense amplifier and a plurality of repair circuit coupled between thebit lines and the sense amplifier, and each of the repair circuitsincludes a second memory cell and a first transistor, the methodcomprises: testing the bit lines with an auto testing equipment; andwriting a first predetermined voltage to the second memory cell to turnon the first transistor when function of the corresponding bit line iscorrect.
 2. The repair method as claimed in claim 1, wherein the firsttransistor is tuned on to connect the sensor amplifier with thecorresponding bit line which is correct.
 3. The repair method as claimin claim 1, further comprising: writing a second predetermined voltageto the second memory cells to turn off the first transistors whenfunction of the corresponding bit line fails.
 4. The repair method asclaim in claim 3, wherein the first transistor is tuned off todisconnect the sensor amplifier with the corresponding bit line whichfails.
 5. A repair method for a non-volatile memory array structurewherein the non-volatile memory array structure includes a plurality ofbit lines, a plurality of first memory cells electrically connected tothe bit lines, a sense amplifier and a plurality of repair circuitcoupled between the bit lines and the sense amplifier, and each of therepair circuits includes a second memory cell and a first transistor,the method comprises: testing the bit lines with an auto testingequipment; and writing a second predetermined voltage to the secondmemory cells to turn off the first transistors when function of thecorresponding bit line fails.
 6. The repair method as claimed in claim5, wherein the first transistor is tuned off to disconnect the sensoramplifier with the corresponding bit line which fails.
 7. The repairmethod as claimed in claim 5, further comprising: writing a firstpredetermined voltage to the second memory cell to turn on the firsttransistor when function of the corresponding bit line is correct. 8.The repair method as claimed in claim 7, wherein the first transistor istuned on to connect the sensor amplifier with the corresponding bit linewhich is correct.
 9. A repair method for a non-volatile memory arraystructure wherein the non-volatile memory array structure includes aplurality of bit lines, a plurality of first memory cells electricallyconnected to the bit lines, a sense amplifier and a plurality of repaircircuit coupled between the bit lines and the sense amplifier, and eachof the repair circuits includes a second memory cell, a first transistorand a second transistor, the method comprises: turning on the firsttransistor of each repair circuit and turning off the second transistorof each repair circuit to test each of the first memory cells; andwriting a second predetermined voltage to the second memory cell to turnoff the first transistor when function of the corresponding bit linefails.
 10. The repair method as claimed in claim 9, further comprising:turning on the second transistor so that an auto testing equipment canwrite the second predetermined voltage to the second memory cell tocontrol the first transistor.
 11. The repair method as claimed in claim9, wherein the first transistor is tuned off to disconnect the sensoramplifier with the corresponding bit line which fails.